NAVAIR 01-1A-509-3
01 March 2005
TM 1-1500-344-23-3
TO 1-1-689-3
has not lifted from the windows. Do not place EPROMs
2-5.3.10.1 Wipe contaminated surface with Cleaning
near a UV light source for long periods of time. Natural
Cloth, CCC-C-46 Class 7 (Volume IV or V, Chapter 2),
sunlight includes ultraviolet light, although at a much
Acid Brush, A-A-289 (Volume IV or V, Chapter 3),
lower intensity than the light from the ultraviolet lamp.
Disposable Applicator (Volume IV or V, Chapter 3), or
Extended exposure of EPROM and ESD devices to
Pipe Cleaner (Volume IV or V, Chapter 3), dampened
sunlight can degrade these devices.
with Cleaning Compound, MIL-PRF-85570 Type II (or
MIL-PRF-87937 (Air Force)) or Cleaning Solvent
(Volume IV or V, Chapter 2) until clean.
WARNING
2-5.3.10.2 Dry surface with Cleaning Cloth, CCC-C-
Ultraviolet Light is harmful to eyes when used
46, Class 7, Disposable Applicator, or Pipe Cleaner.
without the filter. Do not use a cracked or
damaged filter.
2-5.3.11. Cleaning and Removal of Bacteria and Fungi.
Dirt, dust, and other airborne contaminants are leading
2-5.3.9.2. Inspect component for presence of solder
contributors to bacteria and fungus (microbial) attack.
flux residue using ultraviolet light (Volume IV or V,
The best defense against this form of attack is to
Chapter 3). Under ultraviolet light, traces of solder flux
maintain cleanliness and, where possible, low humidity.
resin appear as a fluorescent yellow to brownish
Fungus and bacteria shall be removed from affected
residue.
areas as follows:
WARNING
2-5.3.11.1. Mask air capacitors, relay contacts, open
switches, and tunable coils with Pressure Sensitive
Lead contained in solder can rub off onto a
Tape, SAE-AMS-T-21595 Type I (Volume IV or V,
person's hands from a soldered joint. Lead
oxide is a poison that is not eliminated by the
body and can accumulate over years of
2-5.3.11.2. Treat affected areas in accordance with
exposure. Touching solder followed by
smoking or eating is a potential means of
ingesting trace amounts of lead oxide. Wash
2-5.3.12. Cleaning and Removal of Dust, Dirt, Grease,
hands thoroughly following any soldering/
and Oil. Dust and dirt shall be removed by wetting
desoldering operation.
surface with fresh water as follows:
Alcohol, Isopropyl
6
Compound, Aircraft Cleaning
4
TT-I-735
MIL-PRF-85570
2-5.3.9.3. Solder flux residues shall be removed from
2-5.3.12.1. Apply a solution of one part Aircraft
circuit boards and circuit components in accordance
Cleaning Compound, Class I, MIL-PRF-85570, Type
with Cleaning Track 1 (paragraph 2-4.10.). Use a
II (Volume IV or V, Chapter 2) to ten parts distilled
solution of one part distilled water to three parts of
water. Air Force may use MIL-PRF-87937 Type II or IV
I s o p r o p y l Alcohol, TT-I-735 (Volume I V or V,
as an alternate cleaning compound.
Chapter 2), to clean the affected area. Refer to ANSI/
J-STD-001 for additional information on solder fluxes
2-5.3.12.2. Scrub affected areas of parts with Cleaning
and soldering techniques.
and Polishing Pad, Non-Abrasive (Volume IV or V,
Chapter 2), Cleaning Cloth, CCC-C-46 (Volume IV or
2-5.3.9.4. Store critical circuit components not
V, Chapter 2), Cloth, Cheese-Cloth, CCC-C-440
installed in equipment as specified in paragraph 9-2.4.
(Volume IV or V, Chapter 2), Brush, Acid Swabbing,
Ensure EPROM devices have windows covered. Refer
A-A-289 (Volume IV or V, Chapter 3), Toothbrush, or
to Chapter 8 for packaging information on ESD devices.
Applicator, Cotton Tipped (Volume IV or V, Chapter 3).
2-5.3.10. Cleaning and Removal of Silicone Lubricant.
2-5.3.12.3. Wipe area with Cleaning Cloth, CCC-C-46.
Remove silicone residue from surfaces as follows:
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